Baya Systems is a semiconductor IP and technology company tackling one of the hardest problems in modern chip design: how to efficiently connect the growing number of compute, memory and accelerator blocks inside increasingly complex AI and datacenter silicon. As Moore's Law slows and designers turn to chiplets — assembling multiple smaller dies into a single package — the interconnect fabric that ties those pieces together becomes a critical determinant of performance, power and cost. Baya builds the modular, software-defined fabric technology that addresses this challenge.
The company delivers network-on-chip (NoC) and die-to-die interconnect solutions designed to be adaptable and scalable across diverse workloads. Its approach treats the on-chip and die-to-die fabric as a flexible, software-configurable system rather than a fixed, hand-tuned layout, allowing chip teams to adjust to changing requirements and to compose larger, more capable designs from modular building blocks. Baya explicitly supports emerging open standards such as the Ultra Accelerator Link (UALink) die-to-die interconnect, which the industry is rallying around to scale AI accelerator clusters.
Baya Systems was incorporated in March 2023 and emerged from stealth in June 2024. Despite its youth, the company has attracted backing from some of the most significant names in semiconductors. Its Series B, announced in January 2025, raised more than $36 million and was led by Maverick Silicon, with a strategic investment from EDA giant Synopsys and participation from existing investors Matrix Partners and Intel Capital. That followed an earlier $11 million Series A.
The strategic involvement of Synopsys and Intel Capital is particularly notable: it signals that established industry leaders see Baya's fabric IP as complementary to their tools and roadmaps, and as foundational technology for the chiplet era. Baya targets the designers of next-generation AI accelerators, datacenter processors and automotive systems-on-chip — markets where scaling compute through modular, well-connected silicon is essential.
By focusing on the interconnect layer that knits modern chips together and aligning with industry standards like UALink, Baya Systems positions itself as a key enabler of the AI hardware buildout, helping customers ship more capable silicon faster and at lower risk.